JPS5249643Y2 - - Google Patents
Info
- Publication number
- JPS5249643Y2 JPS5249643Y2 JP1973066660U JP6666073U JPS5249643Y2 JP S5249643 Y2 JPS5249643 Y2 JP S5249643Y2 JP 1973066660 U JP1973066660 U JP 1973066660U JP 6666073 U JP6666073 U JP 6666073U JP S5249643 Y2 JPS5249643 Y2 JP S5249643Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973066660U JPS5249643Y2 (en]) | 1973-06-06 | 1973-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973066660U JPS5249643Y2 (en]) | 1973-06-06 | 1973-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5014360U JPS5014360U (en]) | 1975-02-14 |
| JPS5249643Y2 true JPS5249643Y2 (en]) | 1977-11-11 |
Family
ID=28232029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973066660U Expired JPS5249643Y2 (en]) | 1973-06-06 | 1973-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5249643Y2 (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636138Y2 (en]) * | 1976-02-17 | 1981-08-25 | ||
| JPS629722Y2 (en]) * | 1981-01-13 | 1987-03-06 | ||
| JPS60147140A (ja) * | 1984-01-11 | 1985-08-03 | Hitachi Ltd | 半導体素子チツプの実装方法 |
| JPH0752762B2 (ja) * | 1985-01-07 | 1995-06-05 | 株式会社日立製作所 | 半導体樹脂パッケージ |
| JPH0777247B2 (ja) * | 1986-09-17 | 1995-08-16 | 富士通株式会社 | 半導体装置の製造方法 |
-
1973
- 1973-06-06 JP JP1973066660U patent/JPS5249643Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5014360U (en]) | 1975-02-14 |